EJ196-261518 - Elevating Device Maintenance
EJ196-261518 - Elevating Device Maintenance is a published development and funding opportunity on Contexium. The donor or funder is Department of Public Works and Government Services (PSPC). Project location(s): Canada. Applications close on 07 Jul 2026. All required supporting documentation and bid submission must be submitted by July 7, 2026 at 14:00 EST. All bids submitted after 14:00 EST will result in the bid being declared non-responsive. This requirement is to provide the maintenance services of the elevating devices and must furnish all nece…
Opportunity overview
- Project name
- EJ196-261518 - Elevating Device Maintenance
- Donor
- Department of Public Works and Government Services (PSPC)
Key details
- Opportunity start date
- Opportunity end date
- Project location(s)
- Canada
Summary
Frequently asked questions
What is EJ196-261518 - Elevating Device Maintenance?
EJ196-261518 - Elevating Device Maintenance is a published development and funding opportunity on Contexium. The donor or funder is Department of Public Works and Government Services (PSPC). Project location(s): Canada. Applications close on 07 Jul 2026. All required supporting documentation and bid submission must be submitted by July 7, 2026 at 14:00 EST. All bids submitted after 14:00 EST will result in the bid being declared non-responsive. This requirement is to provide the maintenance services of the elevating devices and must furnish all nece…
Who is funding EJ196-261518 - Elevating Device Maintenance?
EJ196-261518 - Elevating Device Maintenance is funded by Department of Public Works and Government Services (PSPC).
When is the deadline to apply for EJ196-261518 - Elevating Device Maintenance?
The application deadline is 07 Jul 2026 18:00 (UTC).
Where will the EJ196-261518 - Elevating Device Maintenance project take place?
The project location(s) are: Canada.
How can I apply for EJ196-261518 - Elevating Device Maintenance?
Create a free Contexium account to view the full opportunity details and submit an application via the marketplace.