Contexium

Technology Architect - Level 2

Technology Architect - Level 2 is a published development and funding opportunity on Contexium. The donor or funder is Department of Industry (ISED). Project location(s): Canada. Applications close on 06 Jul 2026. This requirement is for a Level 2 - Technology Architect to support various CIPO Application Development Support Directorate (CADSD) projects and initiatives. Services will be centered on the engineering, design, integration, maintenance and support of desktop COTS products & software for Windows 7…

Opportunity overview

Project name
Technology Architect - Level 2
Department of Industry (ISED) logo
Department of Industry (ISED)
Donor
Department of Industry (ISED)

Key details

Opportunity start date
Opportunity end date
Project location(s)
Canada

Summary

This requirement is for a Level 2 - Technology Architect to support various CIPO Application Development Support Directorate (CADSD) projects...

Frequently asked questions

What is Technology Architect - Level 2?

Technology Architect - Level 2 is a published development and funding opportunity on Contexium. The donor or funder is Department of Industry (ISED). Project location(s): Canada. Applications close on 06 Jul 2026. This requirement is for a Level 2 - Technology Architect to support various CIPO Application Development Support Directorate (CADSD) projects and initiatives. Services will be centered on the engineering, design, integration, maintenance and support of desktop COTS products & software for Windows 7…

Who is funding Technology Architect - Level 2?

Technology Architect - Level 2 is funded by Department of Industry (ISED).

When is the deadline to apply for Technology Architect - Level 2?

The application deadline is 06 Jul 2026 18:00 (UTC).

Where will the Technology Architect - Level 2 project take place?

The project location(s) are: Canada.

How can I apply for Technology Architect - Level 2?

Create a free Contexium account to view the full opportunity details and submit an application via the marketplace.