FAC - OBC - SIP - Artwork move, storage and reinstallation
FAC - OBC - SIP - Artwork move, storage and reinstallation is a published development and funding opportunity on Contexium. The donor or funder is STATE, DEPARTMENT OF. Project location(s): Argentina. Applications close on 30 Jun 2026. Please note this solicitation is not ready to be issued as of this date. The Embassy of the United States in Argentina will launch the solicitation on the SAM.gov website when it is available. The requirement is to provide labor and materials for safely removing the specified artwork from walls, sto…
Opportunity overview
- Project name
- FAC - OBC - SIP - Artwork move, storage and reinstallation
- Donor
- STATE, DEPARTMENT OF
Key details
- Opportunity start date
- Opportunity end date
- Project location(s)
- Argentina
Summary
Frequently asked questions
What is FAC - OBC - SIP - Artwork move, storage and reinstallation?
FAC - OBC - SIP - Artwork move, storage and reinstallation is a published development and funding opportunity on Contexium. The donor or funder is STATE, DEPARTMENT OF. Project location(s): Argentina. Applications close on 30 Jun 2026. Please note this solicitation is not ready to be issued as of this date. The Embassy of the United States in Argentina will launch the solicitation on the SAM.gov website when it is available. The requirement is to provide labor and materials for safely removing the specified artwork from walls, sto…
Who is funding FAC - OBC - SIP - Artwork move, storage and reinstallation?
FAC - OBC - SIP - Artwork move, storage and reinstallation is funded by STATE, DEPARTMENT OF.
When is the deadline to apply for FAC - OBC - SIP - Artwork move, storage and reinstallation?
The application deadline is 30 Jun 2026 00:00 (UTC).
Where will the FAC - OBC - SIP - Artwork move, storage and reinstallation project take place?
The project location(s) are: Argentina.
How can I apply for FAC - OBC - SIP - Artwork move, storage and reinstallation?
Create a free Contexium account to view the full opportunity details and submit an application via the marketplace.